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Fresh details leak on Intel Skylake processors and chipsets

Ever since Intel announced it would launch Broadwell (a “tick” or die shrink) and Skylake (a “tock” or new architecture) in the same year, it’s been less-than clear how those two products would overlap and interact in the market. Now, fresh details have leaked from Chinese sources, and they point to some interesting changes for Intel’s high-end SKUs and chipset capabilities.

First up, let’s talk about CPUs.

Enthusiasts who want a six-core or eight-core chip with Skylake will likely have to wait until 2017.

The current Haswell-E family will stay in place for all of 2015, with a Broadwell-E chip launching in 2016, so not much to report there. The unlocked Broadwell-K will be an unlocked 65W part that uses existing LGA1150 motherboards — if you’ve got a Series 8 or Series 9 motherboard, you should be able to adopt Broadwell as well. The shift to a lower TDP is very interesting — either Intel seriously improved on Haswell’s power consumption at high clock speeds, or the company opted to keep the mobile focus and will simply spec lower base and Turbo clocks for the unlocked CPU.

It’s been rumored that Intel may introduce eDRAM caches on Broadwell-K with support for Intel Iris Pro on the mainstream socketed desktop for the first time since that feature debuted. It’s also possible that Broadwell-K will mainly be an OEM option for system builders before Skylake-K debuts in Q3. That chip will have a 95W TDP option in addition to the 65W and 35W CPUs, with both quad-core and dual-core flavors.

Next up, we have the chipset improvements. Unlike Broadwell, it’s assumed that Skylakewill require a chipset update and the sheet confirms this, with the launch of LGA1151.

Source: VR-Zone

The primary columns of interest to most enthusiasts are the changes between the Z97 and Z170. The Z170 will retain the same PCIe 3.0 configuration options for graphics, but makes several changes to connectivity and flexibility. The total number of USB 3.0 ports has been boosted to 10, up from 6, while secondary USB 3.0 connectivity for peripherals is vastly improved, to 20 PCIe 3.0 lanes.

This could be huge for certain motherboard configurations. At present, Intel provides just 8 PCIe 2.0 lanes for features like Thunderbolt add-in cards, NICs, or other peripherals. The other advantage of the improved PCI Express capabilities is a boost to the total lanes for features like PCIe storage via M.2. Z170 systems will now support up to three drives in that configuration. The added PCIe connectivity may also mean that consumers can use M.2 drives simultaneously alongside SATA drives.

Overall, we should see peripheral performance improve in Z170 boards, with some particular advantage for cutting-edge solid state drives. Intel has said relatively little about what CPU-side improvements are coming with Skylake, but the rumors continue to point to substantially better GPU hardware, even over Broadwell. Intel’s integrated graphics plans have often been met with derision from enthusiasts, but the combination of a huge on-die L4 cache and the increased performance on the GPU-side as a secondary display or basic graphics option has its own uses even for customers who plan to invest in discrete cards.

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3 lessons

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